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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12543265 B1

PDFFull Text
Date of Patent:
Feb. 03, 2026

Filed:

Oct. 25, 2023

Semiconductor package and chip thereof

Applicant:

Chipbond Technology Corporation, Hsinchu, TW;

Inventors:

Wei-Hsin Wu, Hsinchu County, TW;

Ku-Pang Chang, Hsinchu, TW;

Chun-Chia Yeh, Hsinchu County, TW;

Assignee:

CHIPBOND TECHNOLOGY CORPORATION, Hsinchu, TW;

Attorneys:

Demian K. Jackson

Jackson IPG PLLC

Primary Examiner:

Victor A Mandala

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 23/49838 (2013.01); H01L 24/08 (2013.01); H05K 1/118 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/16012 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/384 (2013.01);
Abstract

A semiconductor package includes a flexible circuit board and a chip which includes a first bump group and a second bump group. First bumps of the first bump group and second bumps of the second bump group are provided to be bonded to leads on the flexible circuit board. The second bumps are designed to be longer than the first bumps in length so as to increase bonding strength of the second bumps to the leads, prevent the leads from being shifted and separated from the first and second bumps and prevent lead bonding misalignment.

Find Patent Forward Citations

Wu, Wei-Hsin. (2026). Semiconductor package and chip thereof (U.S. Patent No. 12543265). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12543265

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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