Wei Da Lin

Title: Innovations of Wei Da Lin in Semiconductor Technology

Introduction

Wei Da Lin is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to device packaging.

Latest Patents

Wei Da Lin's latest patents include a semiconductor device package and a method of manufacturing the same. This semiconductor device package features a substrate with a surface, a conductive element placed on the substrate's surface, and an encapsulant that covers the conductive element. Notably, the conductive element has an upper surface that faces away from the substrate and is exposed from the encapsulant. Furthermore, the roughness of the upper surface of the conductive element is greater than that of its side surface, enhancing its performance and reliability.

Career Highlights

Wei Da Lin is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronics.

Collaborations

Wei Da Lin collaborates with talented colleagues, including Meng-Jen Wang and Hung Chen Kuo, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.

Conclusion

Wei Da Lin's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence the development of advanced semiconductor devices.