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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11605598 B1

PDFFull Text
Date of Patent:
Mar. 14, 2023

Filed:

Apr. 17, 2020

Semiconductor device package and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Wei Da Lin, Kaohsiung, TW;

Meng-Jen Wang, Kaohsiung, TW;

Hung Chen Kuo, Kaohsiung, TW;

Wen Jin Huang, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Marc Anthony Armand

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/04 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/32131 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/04 (2013.01); H01L 23/3114 (2013.01);
Abstract

A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

Find Patent Forward Citations

Lin, Wei. (2023). Semiconductor device package and method of manufacturing the same (U.S. Patent No. 11605598). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11605598

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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