This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Wei-Chieh Hsu: Innovator in Chip Interconnect Technology
Introduction
Wei-Chieh Hsu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in chip interconnect structures. His innovative work has led to the development of a patented technology that enhances the performance and reliability of electronic devices.
Latest Patents
Wei-Chieh Hsu holds a patent for a "Fine pitch chip interconnect structure for bump bridge and high temperature storage improvement and methods for forming the same." This patent describes an interconnect structure that includes a lower pad with a first conductive layer and a second conductive layer, along with an upper bump and a solder joint. This invention aims to improve the efficiency and durability of chip interconnections.
Career Highlights
Wei-Chieh Hsu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in technology.
Collaborations
One of his notable coworkers is Han-Hsiang Huang, with whom he has likely shared insights and expertise in their field.
Conclusion
Wei-Chieh Hsu's contributions to chip interconnect technology exemplify the innovative spirit of the semiconductor industry. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key player in advancing electronic technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile