This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Wei-Che Lin and a Buffer-Enhanced Chuck for Photoresist Coating.
Introduction
Wei-Che Lin is an inventor associated with Hsinchu, Taiwan. His patent work includes a chuck design intended to support a substrate during photoresist spin coating.
Latest Patents
The available information identifies one patent for Lin: “Chuck with Buffer Portion.” The invention describes placing a substrate on a chuck using vacuum or gravitational force and spin-coating photoresist over it. The chuck has an inorganic base portion and an overlapping, more deformable buffer portion made from an organic composite containing a polymer and a non-Newtonian fluid. Lin is credited with 1 patent.
Career Highlights
Lin is associated with Taiwan Semiconductor Manufacturing Company, Ltd. His listed patent focuses on the chuck structure used in a photoresist coating process.
Collaborations
Lin’s listed coworker is Chien-Wei Wang. The available information does not specify further details about their collaboration.
Conclusion
Wei-Che Lin’s patent describes a chuck that combines a rigid inorganic base with a more deformable composite buffer, offering a specialized approach to supporting substrates during photoresist spin coating.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile