Wayne Meyer

Title: Wayne Meyer: Inventor in Sputtering Target Technology

Introduction

Wayne Meyer is an inventor based in Cheney, Washington, whose patent work focuses on sputtering target assemblies and methods for bonding their components. He works at Solstice Advanced Materials US, Inc. His listed portfolio includes 3 patents.

Latest Patents

Meyer’s recent patent work includes “Mechanical Locking Sputtering Target Bonding Method and Target Assemblies Produced Thereby.” The invention describes forming complementary projections and recesses on a sputtering target and backing plate, aligning the components, and applying pressure to create a void-free interlock bond.

His other listed patent is “Diffusion Bonded Tungsten Containing Target to Titanium or Titanium Alloy Backing Plate.” It describes a sputtering target assembly with a tungsten-containing target, a titanium-containing backing plate, and an interlayer that diffusion-bonds them. The interlayer includes a nickel layer next to the target and a copper layer next to the nickel.

Career Highlights

Meyer’s listed inventions address the joining of sputtering targets to backing plates, including mechanical interlocking and diffusion bonding. These approaches are designed for assemblies that combine different materials, such as tungsten-containing targets and titanium-containing backing plates.

Collaborations

Meyer’s listed coworkers include Xiaodan Wu and Susan D. Strothers. Their shared professional context at Solstice Advanced Materials US, Inc. reflects a collaborative environment for developing materials and manufacturing technologies.

Conclusion

Wayne Meyer’s patent work centers on bonding methods for sputtering target assemblies, with inventions covering both mechanical interlocking and diffusion bonding.