The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2026

Filed:

Dec. 06, 2023
Applicant:

Honeywell International Inc., Charlotte, NC (US);

Inventors:

Xiaodan Wu, Spokane, WA (US);

Susan D. Strothers, Mead, WA (US);

Rashmi Mohanty, Liberty Lake, WA (US);

Wayne Meyer, Cheney, WA (US);

Assignee:

Solstice Advanced Materials US, Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C22C 27/04 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); C22C 27/04 (2013.01);
Abstract

A sputtering target assembly comprises a tungsten containing sputtering target, a copper alloy backing plate attached to the tungsten containing sputtering target, and an interlayer positioned between and diffusion bonding the tungsten containing sputtering target and copper alloy backing plate. The tungsten containing sputtering target comprises 0 wt. % to about 50 wt. % of an alloying component and the balance is tungsten. The alloying component is titanium, aluminum or molybdenum. A method of making is also provided.


Find Patent Forward Citations

Wu, Xiaodan. (2026). Diffusion bonded tungsten containing target to copper alloy backing plate (U.S. Patent No. 12774517). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12774517

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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