The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jul. 31, 2025
Honeywell International Inc., Charlotte, NC (US);
Suiqiong Li, Spokane, WA (US);
Nishanth Selvaraj, Sriracha, TH;
Stephane Ferrasse, Spokane, WA (US);
Wayne Meyer, Cheney, WA (US);
Michael Goodwater, Otis Orchards, WA (US);
Solstice Advanced Materials US, Inc., Morris Plains, NJ (US);
Abstract
A method of forming a bond in a sputtering assembly includes forming first projections on a bonding surface of a sputtering target, forming second projections on a bonding surface of a backing plate, aligning the sputtering target and the backing plate so that the first projections fit within the second recesses and the second projections fit within the first recesses to form an assembly; and applying pressure to the assembly so that first projections form an interlock bond between the sputtering target and the backing plate, wherein the interlock bond is void-free.