Bucheon, South Korea

Wanki Hong

This inventor holds 1 USPTO granted patent. Top assignee: Alpha and Omega Semiconductor (Cayman) Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wanki Hong. Retrieved from https://idiyas.com/inventor/wanki-hong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Wanki Hong: Innovator in Intelligent Power Modules

Introduction

Wanki Hong is a notable inventor based in Bucheon-si, South Korea. He has made significant contributions to the field of power electronics, particularly through his innovative designs in intelligent power modules.

Latest Patents

Wanki Hong holds a patent for a Molded Intelligent Power Module (IPM) for motors. This advanced IPM features a first, second, third, and fourth die supporting elements, along with multiple transistors and integrated circuits. The design includes a connection member and a molding encapsulation that enhances the module's performance. Notably, the IPM exhibits reduced thermal resistance of junction-to-case (RJC) compared to conventional models, making it a valuable advancement in the industry.

Career Highlights

Wanki Hong is currently employed at Alpha and Omega Semiconductor (Cayman) Ltd., where he continues to develop cutting-edge technologies in power management. His work has positioned him as a key player in the semiconductor industry, contributing to the efficiency and reliability of electronic devices.

Collaborations

Wanki collaborates with talented professionals such as Zhiqiang Niu and Bum-Seok Suh, enhancing the innovative capabilities of his team. Their combined expertise fosters a creative environment that drives technological advancements.

Conclusion

Wanki Hong's contributions to the field of intelligent power modules exemplify his commitment to innovation and excellence. His patent for the Molded Intelligent Power Module showcases his ability to address industry challenges effectively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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