Alpha and Omega Semiconductor (cayman) Ltd.

Wanki Hong

Jun Lu

Zhiqiang Niu

Bum-Seok Suh

Son Tran

Xiaoguang Zeng

Mary Jane R Alin

Guobing Shen

An intelligent power module (IPM) has a first, second, third and fourth die supporting elements, a first, second, third, fourth, fifth and sixth transistors, a connection member, a low voltage IC, a high voltage IC, a plurality of leads and a molding encapsulation. The first transistor is attached to the first die supporting element. The second transistor is attached to the second die supporting element. The third transistor is attached to the third die supporting element. The fourth, fifth and sixth transistor s are attached to the fourth die supporting element. The low and high voltage ICs are attached to the connection member. The molding encapsulation encloses the first, second, third and fourth die supporting elements, the first, second, third, fourth, fifth and sixth transistors, the connection member and the low and high voltage ICs. The IPM has a reduced thermal resistance of junction-to-case (RJC) compared to a conventional IPM.

Molded intelligent power module for motors

Growing community of inventors

Bucheon-si, South Korea

Wanki Hong