Company Filing History:
Years Active: 2025
Title: Wangyu Lim: Innovator in Semiconductor Processing
Introduction
Wangyu Lim is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approaches to substrate processing.
Latest Patents
One of his latest patents is a semiconductor processing method that involves a substrate processing technique for forming an air gap. This method includes forming deposition inhibitor sites in a lower space between a first protrusion and a second protrusion. It also entails forming film-forming sites and an interlayer insulating layer on the first and second protrusions. The interlayer insulating layer is selectively formed in an upper space between the protrusions, resulting in the creation of an air gap.
Another notable patent is a thin-film deposition method and system. This invention discloses a method and system for forming a film on a substrate. The exemplary methods include using a first plasma condition to create a layer of deposited material with good film thickness uniformity. It also involves using a second plasma condition to treat the deposited material, forming treated material, and employing a third plasma condition to create a surface-modified layer with reactive sites on the treated material.
Career Highlights
Wangyu Lim is currently associated with Asm IP Holding B.V., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing methods that enhance the efficiency and effectiveness of semiconductor processing.
Collaborations
He collaborates with notable professionals in the field, including YoungJae Kim and Shinya Ueda. Their combined expertise contributes to the innovative projects they undertake together.
Conclusion
Wangyu Lim's contributions to semiconductor processing through his patents reflect his dedication to innovation in technology. His work continues to influence the industry and pave the way for future advancements.