The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Nov. 02, 2022
Applicant:
Asm Ip Holding B.v., Almere, NL;
Inventors:
Shinya Ueda, Kai, JP;
Seokjae Oh, Suwon-si, KR;
Hyungyu Jang, Osan-si, KR;
Heesung Kang, Anyang-si, KR;
Wangyu Lim, Hwaseong-si, KR;
Hyounmo Choi, Hwaseong-si, KR;
Youngjae Kim, Cheonan-si, KR;
Assignee:
ASM IP Holding B.V., Almere, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/505 (2006.01); C23C 16/34 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); C23C 16/56 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 16/505 (2013.01); C23C 16/345 (2013.01); C23C 16/45536 (2013.01); C23C 16/4554 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); H01J 37/32449 (2013.01); H01J 37/32743 (2013.01); H01J 2237/3321 (2013.01);
Abstract
A method and system for forming a film on a substrate are disclosed. Exemplary methods include using a first plasma condition to form a layer of deposited material having a good film thickness uniformity, using a second plasma condition to treat the deposited material and thereby form treated material, and using a third plasma condition to form a surface-modified layer—e.g., reactive sites on the treated material.