Wan Wook Ko

Title: Innovations by Wan Wook Ko in Die-Mounting Substrates

Introduction

Wan Wook Ko is an accomplished inventor based in Seoul, South Korea. He has made significant contributions to the field of die-mounting substrates, particularly through his innovative patent that enhances manufacturing processes.

Latest Patents

Wan Wook Ko holds a patent for a die-mounting substrate and method incorporating dummy traces for improving mounting film planarity. This invention simplifies the manufacturing process and enables film attachment in applications where it was previously impractical. The die-mounting substrate features dummy traces generated alongside signal traces that extend into the die mounting area. These dummy traces are designed according to the same rules as the signal traces and are strategically placed in otherwise empty regions between signal traces and vias. This design results in a die mounting area that avoids regions devoid of signal traces, which can lead to surface variations that compromise the film bond.

Career Highlights

Wan Wook Ko is currently employed at Amkor Technology, Inc., where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in advancing the technology used in die-mounting substrates.

Collaborations

He collaborates with notable colleagues, including Roger D St Amand and Chang Suk Han, who contribute to the innovative environment at Amkor Technology, Inc.

Conclusion

Wan Wook Ko's contributions to die-mounting substrates reflect his commitment to innovation and excellence in the semiconductor industry. His patent demonstrates a significant advancement in manufacturing processes, showcasing his role as a leading inventor in this field.