The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2010

Filed:

Apr. 21, 2005
Applicants:

Roger D. St. Amand, Tempe, AZ (US);

Chang Suk Han, Sungnam, KR;

Alexander W. Copia, Chandler, AZ (US);

Wan Wook Ko, Seoul, KR;

Inventors:

Roger D. St. Amand, Tempe, AZ (US);

Chang Suk Han, Sungnam, KR;

Alexander W. Copia, Chandler, AZ (US);

Wan Wook Ko, Seoul, KR;

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A die-mounting substrate and method incorporating dummy traces for improving mounting film planarity makes the use of film attach possible with a simplified manufacturing process and in applications where film-attach was not previously practical. The die-mounting substrate includes dummy traces that are generated along with signal traces extending into the die mounting area of the substrate. The dummy traces are designed according to the same design rules as the signal traces and are disposed in otherwise empty regions between signal traces and vias within the die mounting area. The result is die mounting area without regions empty of signal traces that previously either lack conductor or are filled completely with conductor, either of which will result in surface variation that compromises the film bond.


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