Alexander William Copia

Title: Innovations of Alexander William Copia

Introduction

Alexander William Copia is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic packaging, holding a total of 4 patents. His work focuses on developing advanced packaging solutions that enhance the performance and efficiency of electronic components.

Latest Patents

Copia's latest patents include the "Thin stackable package and method" and the "Stacked inverted flip chip package and fabrication method." The thin stackable package features a fan-out buildup substrate that allows for a high-density interconnect on both sides, enabling additional devices to be stacked. This innovation is particularly beneficial for applications requiring compact and efficient electronic designs. The stacked inverted flip chip package minimizes height by placing a secondary electronic component between the primary electronic component structure and the substrate, optimizing space without compromising functionality.

Career Highlights

Copia is currently employed at Amkor Technology, Inc., where he continues to push the boundaries of electronic packaging technology. His work has been instrumental in advancing the capabilities of modern electronic devices, making them more efficient and compact.

Collaborations

Throughout his career, Copia has collaborated with esteemed colleagues such as Roger D St Amand and Robert Francis Darveaux. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.

Conclusion

Alexander William Copia's contributions to electronic packaging through his innovative patents have significantly impacted the industry. His work exemplifies the importance of creativity and collaboration in advancing technology.