The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Jul. 31, 2008
Roger D. St. Amand, Tempe, AZ (US);
August Joseph Miller, Jr., Queen Creek, AZ (US);
Alexander William Copia, Chandler, AZ (US);
Kwangseok OH, Gyeonggi-do, KR;
Roger D. St. Amand, Tempe, AZ (US);
August Joseph Miller, Jr., Queen Creek, AZ (US);
Alexander William Copia, Chandler, AZ (US);
KwangSeok Oh, Gyeonggi-do, KR;
Abstract
A stacked inverted flip chip package includes a substrate having a secondary electronic component opening and first traces. Primary flip chip bumps electrically and physically couple a primary electronic component structure to the substrate. Secondary flip chip bumps electrically and physically couple an inverted secondary electronic component to the primary electronic component structure between the primary electronic component structure and the substrate and within the secondary electronic component opening. By placing the secondary electronic component between the primary electronic component structure and the substrate, the height of the stacked inverted flip chip package is minimized.