Hsinchu, Taiwan

Wan-Hsien Lin

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2022-2025

where 'Filed Patents' based on already Granted Patents

3 patents (USPTO):

Title: Wan-Hsien Lin: Innovator in Semiconductor Technology

Introduction

Wan-Hsien Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and devices that enhance semiconductor performance and manufacturing processes.

Latest Patents

Among his latest patents, Wan-Hsien Lin has developed a semiconductor device and method that involves selectively depositing a metal layer over a gate structure. This invention includes a channel region over a semiconductor substrate, a gate structure, and a barrier layer that enhances the device's functionality. Another notable patent is related to a cut metal gate refill with void, which describes a process for etching a gate stack to create a trench. This trench allows for the formation of a dielectric region with an air gap, improving electrical isolation between gate stack portions.

Career Highlights

Wan-Hsien Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has positioned him as a key player in advancing semiconductor technologies.

Collaborations

Throughout his career, Wan-Hsien Lin has collaborated with notable colleagues, including Ting-Gang Chen and Chi On Chui. These partnerships have contributed to the development of innovative solutions in semiconductor manufacturing.

Conclusion

Wan-Hsien Lin's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor devices and methods.

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