The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2025

Filed:

Jul. 24, 2022
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Ting-Gang Chen, Taipei, TW;

Wan-Hsien Lin, Hsinchu, TW;

Chieh-Ping Wang, Taichung, TW;

Tai-Chun Huang, Hsinchu, TW;

Chi On Chui, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2005.12); H01L 21/28 (2005.12); H01L 21/764 (2005.12); H01L 21/8238 (2005.12); H01L 23/535 (2005.12); H01L 27/092 (2005.12); H01L 29/06 (2005.12); H01L 29/66 (2005.12);
U.S. Cl.
CPC ...
H01L 21/28123 (2012.12); H01L 21/764 (2012.12); H01L 21/823821 (2012.12); H01L 21/823828 (2012.12); H01L 21/823871 (2012.12); H01L 21/823878 (2012.12); H01L 23/535 (2012.12); H01L 27/0924 (2012.12); H01L 29/0653 (2012.12); H01L 29/66545 (2012.12);
Abstract

A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.


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