Location History:
- Burgkirchen, DE (1989 - 1993)
- Burgkirchen/Alz, DE (1999)
Company Filing History:
2 out of 113 
1 out of 42 
1 out of 1 Years Active: 1989-1999
Title: Walter Frank: Innovator in Wafer Cutting Technology
Introduction
Walter Frank is a notable inventor based in Burgkirchen, Germany. He has made significant contributions to the field of wafer cutting technology, holding a total of four patents. His innovative approaches have advanced the methods used in the semiconductor industry.
Latest Patents
One of Walter Frank's latest patents is a method for cutting wafers from a crystal. This invention involves a sawing suspension composition made of an essentially nonaqueous or anhydrous organic liquid, in which hard-material particles are dispersed. The liquid is selected from a group of compounds that includes low molecular weight polyglycols and any desired mixture of these polyglycols. This sawing suspension is utilized in conjunction with a wire saw for cutting wafers from a crystal of brittle and hard material.
Another significant patent is for an apparatus and method of automatically separating stacked wafers. Traditionally, the separation of thin disk-type workpieces from a stack has been performed manually. Walter Frank's invention allows for the lifting of a wafer off the stack without mechanical contact. The method involves introducing a stack of disk-type workpieces into a wafer magazine, where a feed unit brings the uppermost wafer into the sphere of action of a fluid medium that emerges under pressure from a nozzle system. This innovative approach ensures damage-free separation and increases yield.
Career Highlights
Walter Frank has worked with prominent companies in the semiconductor industry, including Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH and Wacker Siltronic Gesellschaft für Halbleitermaterialien AG. His experience in these organizations has contributed to his expertise in wafer technology and innovation.
Collaborations
Walter Frank has collaborated with notable individuals in his field, including Albert Pemwieser and Gerhard Spatzier. These collaborations have likely enriched his work and contributed to the development of his patents.
Conclusion
Walter Frank's contributions to wafer cutting technology demonstrate his innovative spirit and commitment to advancing the semiconductor industry. His patents reflect a deep understanding of the challenges in this field and provide solutions that enhance efficiency and yield.