Company Filing History:
Years Active: 2016
Title: Wai Hung William Hor: Innovator in Semiconductor Technology
Introduction
Wai Hung William Hor is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His innovative work focuses on leadless semiconductor packages and methods that enhance the efficiency and functionality of semiconductor devices.
Latest Patents
Hor's latest patents include a method for forming semiconductor devices on a leadframe structure. This method involves providing electrical connections between terminals of leadframe sub-structures and the leadframe structure itself. The encapsulation of the leadframe structure, electrical connections, and terminals in an encapsulation layer is a key aspect of this innovation. Additionally, the method includes performing a series of parallel cuts to expose terminal portions and electro-plating these terminals to create metal side pads. Another notable patent is for a leadless packaged semiconductor device featuring multiple I/O side-solderable terminals. This device comprises a lead frame sub-assembly with an array of lead frame portions, each housing a semiconductor die. The design includes at least five I/O terminals, each equipped with a metal side pad that is electroplated and designed to accept solder.
Career Highlights
Wai Hung William Hor is currently associated with NXP B.V., a company known for its advancements in semiconductor technology. His work at NXP B.V. has positioned him as a key player in the development of innovative semiconductor solutions.
Collaborations
Hor has collaborated with notable colleagues such as Chi Ho Leung and Soenke Habenicht, contributing to the advancement of semiconductor technologies through teamwork and shared expertise.
Conclusion
Wai Hung William Hor's contributions to semiconductor technology through his patents and work at NXP B.V. highlight his role as an influential inventor in the industry. His innovative methods and designs continue to shape the future of semiconductor devices.