The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2016
Filed:
Oct. 29, 2014
Nxp B.v., Eindhoven, NL;
Chi Ho Leung, Kowloon, HK;
Wai Hung William Hor, Tsuen Wan, HK;
Soenke Habenicht, Hamburg, DE;
Pompeo Umali, Kwai Chung, HK;
WaiKeung Ho, Kwai Chung, HK;
Yee Wai Fung, Kwai Chung, HK;
NXP B.V., Eindohven, NL;
Abstract
Consistent with an example embodiment, there is leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. There are at least five I/O terminals wherein each of said terminals comprise a respective metal side pad wherein the respective metal side pad is disposed in a recess. A feature of this embodiment is that the each of the side pads is electroplated. The electroplated side pads accept solder and the solder menisci are contained by the recesses.