WaiKeung Ho

Title: The Innovations of WaiKeung Ho

Introduction

WaiKeung Ho is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that showcases his expertise and creativity.

Latest Patents

WaiKeung Ho holds a patent for a "Package with multiple I/O side-solderable terminals." This invention features a leadless packaged semiconductor device with top and bottom opposing major surfaces and sidewalls extending between them. The device includes a lead frame sub-assembly with an array of lead frame portions, each housing a semiconductor die. Notably, it comprises at least five I/O terminals, each featuring a metal side pad located in a recess. A key aspect of this design is that the side pads are electroplated, allowing them to accept solder while containing the solder menisci within the recesses. This innovative approach enhances the functionality and reliability of semiconductor devices.

Career Highlights

WaiKeung Ho is associated with NXP B.V., a leading company in the semiconductor industry. His work at NXP has allowed him to push the boundaries of technology and contribute to advancements in electronic components. His patent reflects his commitment to innovation and excellence in his field.

Collaborations

WaiKeung Ho has collaborated with talented individuals such as Chi Ho Leung and Wai Hung William Hor. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

WaiKeung Ho's contributions to the semiconductor industry through his innovative patent demonstrate his expertise and dedication to advancing technology. His work continues to influence the field and inspire future innovations.