This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 1990.
Company Filing History:
Years Active: 1990
Title: Wade D Jorgensen: Innovator in Semiconductor Packaging
Introduction
Wade D Jorgensen is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods of sealing ceramic lids on semiconductor packages. His work is essential for enhancing the efficiency and reliability of electronic devices.
Latest Patents
Wade D Jorgensen holds a patent for a method of sealing a ceramic lid on a ceramic semiconductor package using a high-power laser beam. This innovative process involves creating a lid recess around the die installation cavity of the package body. After installing a die, a pick and place robot retrieves the package body and positions it in a fixture. The robot then places a ceramic lid within the recess. A Yttrium-Aluminum-Garnet (YAG) laser, moved by an X-Y table arm, fuses the lid to the package body with remarkable speed and precision. The total process time for hermetically sealing the lid is less than two seconds, showcasing the efficiency of this method.
Career Highlights
Wade D Jorgensen is currently employed at Micron Technology Incorporated, where he continues to innovate in the semiconductor industry. His work has contributed to advancements in packaging technology, which is crucial for the performance of modern electronic devices.
Collaborations
Wade has collaborated with notable colleagues such as Larry Duane Kinsman and Steven H Laney. Their combined expertise has fostered a productive environment for innovation at Micron Technology.
Conclusion
Wade D Jorgensen's contributions to semiconductor packaging through his patented methods demonstrate his commitment to innovation in technology. His work not only enhances the efficiency of electronic devices but also sets a standard for future advancements in the field.