The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 1990
Filed:
Jul. 24, 1989
Micron Technology, Inc., Boise, ID (US);
Abstract
A method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser beam. As an aid to package assembly prior to the fusion of the package lid to the package body, a lid recess is created around the die installation cavity of the package body. Following the installation of a die within a package cavity, the package body is retrieved from a process tray by a pick and place robot and placed in a position locating fixture. The same robot then retrieves a ceramic lid from an automatic lid dispensing unit, and places it within the lid recess of the package body. With the lid positioned within the recess, a Yttrium-Aluminum-Garnet (YAG) laser with beam splitter optics is moved by an X-Y table arm precisely over the top of the package. Moving with a linear speed of approximately 2.1 cm/sec. and with a power setting of approximately 170 watts, the split beam YAG laser simultaneously fuses a pair of opposite edges of the lid to the adjacent edges of the recess. A second pass with the split beam laser fuses the remaining pair of lid edges to the package body. Total process time for hermetically sealing the lid to the body is less than two seconds. Once the package is sealed, the robot retrieves the part and places it in an output queue.