Steven H Laney

Title: Innovations of Steven H. Laney

Introduction

Steven H. Laney is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor packaging and memory technology. With a total of 2 patents, his work has had a considerable impact on the industry.

Latest Patents

One of Laney's latest patents is a method of sealing a ceramic lid on a ceramic semiconductor package using a high-power laser beam. This innovative process involves creating a lid recess around the die installation cavity of the package body. After installing a die within the package cavity, a pick and place robot retrieves the package body and positions it in a fixture. The robot then retrieves a ceramic lid and places it within the recess. A Yttrium-Aluminum-Garnet (YAG) laser, moved by an X-Y table arm, fuses the edges of the lid to the package body in less than two seconds.

Another significant patent is for a switched memory module. This design features a printed circuit board that conforms to a single in-line memory module (SIMM) configuration but includes multiple rows of memory devices. By controlling a sequence of enable signals, the selection of a single row from the multiple rows can be accomplished, effectively multiplying the memory capacity of the board.

Career Highlights

Laney is currently employed at Micron Technology Incorporated, where he continues to innovate in the semiconductor field. His work has contributed to advancements in memory technology and packaging solutions.

Collaborations

Some of his notable coworkers include Larry Duane Kinsman and Wade D. Jorgensen, who have also made significant contributions to the field.

Conclusion

Steven H. Laney's innovative patents and contributions to semiconductor technology highlight his importance as an inventor in the industry. His work continues to influence advancements in memory and packaging solutions.