Pfullingen, Germany

Volker Schmitz

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 2.8

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2012-2021

where 'Filed Patents' based on already Granted Patents

7 patents (USPTO):

Title: The Innovative Contributions of Volker Schmitz

Introduction

Volker Schmitz is a notable inventor based in Pfullingen, Germany. He has made significant contributions to the field of micromechanics and wafer bonding technology. With a total of 7 patents to his name, Schmitz has demonstrated a commitment to advancing innovation in his field.

Latest Patents

Among his latest patents is a method for bonding wafers eutectically. This method includes several steps: first, providing a first wafer with a bonding layer and a second wafer with a bonding layer and a spacer. Next, the first wafer is brought into juxtaposition with the second wafer, with the spacer resting against the first bonding layer. The two wafers are then pressed together until the bonding layers abut, allowing the spacer to penetrate the first bonding layer. Finally, the first wafer is bonded to the second wafer eutectically by forming a eutectic alloy from parts of both bonding layers. Additionally, he has developed a method for producing a micromechanical component, which involves patterning a substrate device and/or a cap device, adjusting pressures and chemical compositions, and sealing cavities to create a micromechanical component.

Career Highlights

Volker Schmitz is currently employed at Robert Bosch GmbH, a leading company in the engineering and technology sector. His work at Bosch has allowed him to focus on innovative solutions in micromechanics and wafer technology. His expertise has contributed to the development of advanced micromechanical devices.

Collaborations

Throughout his career, Schmitz has collaborated with notable colleagues, including Axel Grosse and Ralf Hausner. These collaborations have fostered an environment of innovation and have led to the successful development of various technologies.

Conclusion

Volker Schmitz's contributions to the field of micromechanics and wafer bonding are significant and impactful. His innovative methods and dedication to research continue to influence advancements in technology.

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