Robert Boschgmbh

Volker Schmitz

Axel Grosse

Ralf Hausner

Heiko Stahl

Udo Bischof

Lutz Mueller

Achim Breitling

Andreas Scheurle

Holger Hoefer

Hendrik Specht

Hartmut Kueppers

Christof Schwenk

Nicole Schittenhelm

Marlene Winker

A method for bonding wafers eutectically, including the steps: (a) providing a first wafer having a first bonding layer and a second wafer having a second bonding layer and a spacer; (b) bringing the first wafer in juxtaposition with the second wafer, the spacer resting against the first bonding layer; (c) pressing the first wafer and the second wafer together, until the first bonding layer and the second bonding layer abut, the spacer penetrating the first bonding layer; (d) bonding the first wafer to the second wafer eutectically, by forming a eutectic alloy of at least parts of the first bonding layer and the second bonding layer. Also described is a eutectically bonded wafer composite and a micromechanical device having such a eutectically bonded wafer composite.

Method for bonding wafers eutectically, and a wafer composite

A method for producing a micromechanical component is provided, In a preparatory step, a substrate device of the micromechanical component and/or a cap device of the micromechanical component is patterned. In a first sub-step, a first pressure and/or a first chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a first cavern is formed, sealed from an environment of the micromechanical component, the first pressure prevailing in the first cavity and/or the first chemical composition being enclosed. In a second sub-step, a second pressure and/or a second chemical composition being adjusted, and the substrate device and the cap device being connected to each other so that a second cavity is formed, sealed from the environment of the micromechanical component and from the first cavity, the second pressure prevailing in the second cavity and/or the second chemical composition being enclosed.

Method for producing a micromechanical component

A micromechanical component having a main extension plane is provided; the micromechanical component encloses a first cavern and a second cavern, and a first pressure prevails in the first cavern while a second pressure prevails in the second cavern, and a first layer of the micromechanical component, which extends essentially parallel to the main extension plane, projects into a second layer of the micromechanical component, which extends essentially parallel to the main extension plane, between the first cavern and the second cavern, essentially in a perpendicular direction to the main extension plane.

Micro-mechanical component

A micromechanical component having a substrate, a micromechanical functional layer situated above the substrate, and an encapsulation layer situated above the functional layer, and a method for producing the micromechanical component are provided, the encapsulation layer having at least one trench, and a bridging of the trench by at least one electrically insulating connection link is provided.

Micromechanical component and method for producing a micromechanical component having a thin-layer cap

An integrated component having a substrate, the substrate having a cavity which surrounds a mechanical structure. The cavity is filled by a fluid of a specific composition under a specific pressure, and the mechanical properties of the mechanical structure are influenced by the fluid.

Method for sealing an opening

A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access opening.

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Pfullingen, Germany

Volker Schmitz