Novosibirsk, Russia

Vladimir Gaysler


 

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2013

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3 patents (USPTO):Explore Patents

Title: Vladimir Gaysler: Innovator in Nanotechnology and Photonics

Introduction

Vladimir Gaysler is a prominent inventor based in Novosibirsk, Russia. He has made significant contributions to the fields of nanotechnology and photonics, holding a total of three patents. His innovative work focuses on the development of advanced materials and devices that have the potential to revolutionize various technological applications.

Latest Patents

Gaysler's latest patents include a device known as "Layer assembly," which features a locally modified buried first layer. This device incorporates a second layer arranged on top of the first layer, where the modified material of the first layer induces mechanical strain in the second layer. Additionally, he has developed a "Single-photon source and method for the production and operation thereof." This method allows for the production of a single photon source with specific operational performance by adjusting the fine structure gap of the excitonic energy level for quantum dots.

Career Highlights

Throughout his career, Gaysler has worked at prestigious institutions, including the Technische Universität Berlin. His research has focused on the intersection of materials science and quantum technology, leading to groundbreaking advancements in the field.

Collaborations

Gaysler has collaborated with notable colleagues such as André Strittmatter and Andrei Schliwa. These partnerships have fostered a collaborative environment that enhances the innovation process and leads to significant scientific discoveries.

Conclusion

Vladimir Gaysler's contributions to nanotechnology and photonics exemplify the spirit of innovation. His patents and collaborative efforts continue to push the boundaries of technology, paving the way for future advancements in these critical fields.

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