Houston, TX, United States of America

Vincent W Michna

This inventor holds 16 USPTO granted patents and 4 published patent applications and 2 EPO patents, primarily in Computer Systems. Top assignees: Hewlett Packard Enterprise Development LP, Hewlett-Packard Development Company, L.p.. Active years: 2011-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Vincent W Michna. Retrieved from https://idiyas.com/inventor/vincent-w-michna

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2011-2024

Loading Chart...
Loading Chart...
Areas of Expertise:
Processor Performance
High-Speed Interconnect
Fluid Cooling Assembly
Power Control
Server Infrastructure
Electrical Connector
Memory Device
Data I/O Types
Backplane Systems
Modular Server
Video Content Delivery
Flexible Filter Assembly
16 patents (USPTO):Explore Patents

Title: Vincent W. Michna: Innovator in Computing Technology

Introduction

Vincent W. Michna is a prominent inventor based in Houston, TX (US), known for his significant contributions to computing technology. He holds a total of 16 patents, showcasing his innovative spirit and technical expertise in the field.

Latest Patents

Among his latest patents, Michna has developed a "Variable Enhanced Processor Performance" technology. This compute device includes processors that operate at variable performance levels, depending on the power supplied from the device's power supply. A baseboard management controller periodically calculates an adjustment value for the power supply to optimize the power delivered to the processors, based on a thermal margin and operating limits. Another notable patent is the "Dual-Path High-Speed Interconnect PCB Layout Solution." This invention features a dual-path signal interconnect that allows high-speed electrical signals to be routed efficiently through solder pads and signal traces, enhancing connectivity and performance.

Career Highlights

Vincent Michna has worked with leading companies in the technology sector, including Hewlett Packard Enterprise Development LP and Hewlett-Packard Development Company, L.P. His experience in these organizations has contributed to his development of innovative solutions in computing.

Collaborations

Throughout his career, Michna has collaborated with talented individuals such as Nilashis Dey and David Scott Chialastri. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Vincent W. Michna's contributions to computing technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in processor performance and interconnect solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…