Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Vincent W Michna

Nilashis Dey

Patrick A Raymond

David Scott Chialastri

Yasir Jamal

Peter A Hansen

John P Franz

Zheila N Madanipour

Kevin B Leigh

David W Sherrod

Charles E Cornwell

Chi Kim Sides

Kurt A Manweiler

Stephen Kay

Paul Danna

Julie Victoria Tan

Chandler Ray Harris

Martha Gomez, Sr

Quoc Hung C Vu

Gregory L Gibson

David G Carpenter

Jonathan E James Ou

Miles B Reyes

A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.

Variable enhanced processor performance

A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

Dual-path high-speed interconnect PCB layout solution

A process includes, responsive to a computer platform being in a pre-operating system mode of operation, a first controller receiving serial data from a first external communication connector of the computer platform and the first controller providing a video output based on the serial data; and routing the video output of the first controller to a display device connector. The process includes, determining whether a video driver of the computer platform is communicating with a second controller via a second external communication connector of the computer platform. The video driver is associated with an operating system mode of operation of the computer platform. The process includes, in response to determining that the video driver is communicating with the second controller, routing a video output of the second controller to the display device connector in place of the video output of the first controller.

Providing video content for pre-boot and post-boot environments of computer platforms

Example implementations relate to a computing system having a flexible filter assembly. The computing system includes a chassis having an internal volume, a pair of guide rails, a flexible filter assembly, and a plurality of first electronic components. The pair of guide rails is disposed spaced apart from each other and coupled to the chassis. The flexible filter assembly is disposed within and connected to the chassis via the pair of guide rails. The flexible filter assembly splits the internal volume into first and second volume portions. The first volume portion is located downstream relative to flow of supply air. The flexible filter assembly slides into the chassis along the pair of guide rails to detachably connect to the chassis. The flexible filter assembly cleans the supply air and directs clean air towards the plurality of first electronic components disposed in the first volume portion and coupled to the chassis.

Computing system having a flexible filter assembly

Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

Fluid cooling assembly for a computing system

Example implementations relate to a power control system for controlling transmission of power from one or more power supply devices to one or more loads of a modular server enclosure. The power control system includes an electronic fuse and a threshold control unit. The electronic fuse is connected between one or more loads and the one or more power supply devices of the modular server enclosure. The threshold control unit is connected to the electronic fuse and to the one or more power supply devices. The threshold control circuit dynamically adjusts a threshold current for the electronic fuse based on a power supply capacity of the one or more power supply devices. The electronic fuse controls the transmission of the power from the one or more power supply devices to the one or more loads based on threshold current and a load current drawn by the one or more loads.

Power control system for a modular server enclosure

An apparatus comprises a switch and nodes coupled to the switch. Each node does not include an integrated video controller and transmits data to the switch via a USB and a serial connection. The switch comprises a controller which stores video output generated based on data received via serial connections. The controller: receives a user selection for a first node; transmits the user selection to a first multiplexer; retrieves a first video output generated based on data received via the corresponding serial connection; and transmits the first video output to a second multiplexer. The first multiplexer transmits USB data received from the first node to the second multiplexer. If the first node is in a pre-boot environment, the second multiplexer selects the first video output for transmission. If the first node is in a post-boot environment, the second multiplexer selects the data received from the first node for transmission.

Keyboard/video/monitor switch for servers without integrated video controller

An example electrical connector includes a magnetic core embedded in the overmold and encircling conductive paths therein and a Hall-effect sensor embedded in the overmold and configured to sense a magnetic field of the magnetic core. The Hall-effect sensor generates an output that indicates whether or not the supply current flowing through the connector matches the return current flowing through the connector, and this output may be used to detect stray-current faults in which current bypasses the connector to return via alternative paths such as through a device chassis. The connector may include one or more supply wires embedded in the overmold, one or more return wires embedded in the overmold, one or more supply terminals embedded in the overmold and terminating the supply wires, and one or more return terminals embedded in the overmold and terminating the return wires. The magnetic core embedded in the overmold may encircle (a) the supply terminals or the supply wires or both, and (b) the return terminals or the return wires or both.

Electrical connector with integrated current sensor

Systems and methods are provided for providing thermal protection to a power backplane printed circuit board. A distributed hotspot detection grid is included in the printed circuit board, the distributed hotspot detection grid comprising a plurality of passive temperature sensors spread across the printed circuit board to measure temperature increases. The plurality of passive temperature sensors are connected to a detection circuit for comparing signals from the passive temperature sensors to a reference signal. If the temperature increases on the PCB, electrical characteristics of at least one passive temperature sensor will change, resulting in a change of the input signal to the detection circuit. When the threshold is exceeded (indicating a potential short circuit or hotspot), the detection circuit outputs a shut down signal to the one or more power supplies connected to the of the backplane printed circuit board, to avoid catastrophic damage to the printed circuit board.

Power backplane with distributed hotspot detection grid

An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.

Memory device with memory modules located within liquid coolant chamber

Examples described herein include a backplane keying mechanism. The backplane keying mechanism may include a backplane, a first connector, a second connector, a first block for the first connector, and a second block for the second connector. The first block and the second block may be moveable as one unit on the backplane from a first state to a second state. In the first state, the first block allows the first connect to connect to a first type of device and the second block allows the second connector to connect to the first type of device. In the second state, the first block prohibits the first connector from connecting to the first type of device and the second block prohibits the second connector from connecting to the first type of device.

Backplane keying mechanism

Various examples described herein provide for determining a first data input/output (I/O) type of a computing device module and a second data I/O type of an I/O switch module, where the computing device module and the I/O switch module are coupled through a backplane system that includes a retimer. In response to the first data I/O type matching the second data I/O type, a connection between the computing device module and the I/O switch module may be permitted or prevented via the retimer.

Matching data I/O types on backplane systems

According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.

Server

Examples disclosed herein relate to determining a power sense output based on a current sense line and a voltage sense line. A first stage circuit has a first voltage input of the current sense line of a server. The first stage circuit also has a feedback voltage input based on an output voltage of the first stage circuit and a variable resistance value based on the voltage sense line of the server. A second stage circuit is used to buffer the first output voltage to yield a second output voltage. A third stage circuit yields a power sense output based on a difference between the second output voltage and the first voltage input.

Growing community of inventors

Houston, TX, United States of America

Vincent W Michna