The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2023

Filed:

Oct. 12, 2021
Applicant:

Hewlett Packard Enterprise Development Lp, Houston, TX (US);

Inventors:

Vincent W. Michna, Houston, TX (US);

David S. Chialastri, Houston, TX (US);

Nilashis Dey, Houston, TX (US);

Yasir Jamal, Houston, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G06F 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G06F 1/183 (2013.01); H05K 7/20254 (2013.01); G06F 2200/201 (2013.01); H05K 7/20272 (2013.01);
Abstract

Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.


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