Venkateshwaran Vaiyapuri

This inventor holds 14 USPTO granted patents. Top assignees: Micron Technology Incorporated, Micro Technology, Inc.. Active years: 2001-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Venkateshwaran Vaiyapuri. Retrieved from https://idiyas.com/inventor/venkateshwaran-vaiyapuri

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14

% Patents Active = 71.4

Average Co-Inventor Count = 1.2

ph-index = 9

Forward Citations = 245(Granted Patents)

Location History:

Singapore, SG (2001 - 2008)
Singapore, MY (2009)

Company Filing History:

13 out of 39,253

Micron Technology Incorporated

patents

1 out of 59

Micro Technology, Inc.

patents

Years Active: 2001-2009

Loading Chart...

14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7514776 - Semiconductor/printed circuit board assembly, and computer system (2009-04-07),

2. 7427535 - Semiconductor/printed circuit board assembly, and computer system (2008-09-23),

3. 7107777 - MEMS heat pumps for integrated circuit heat dissipation (2006-09-19),

4. 7084004 - MEMS heat pumps for integrated circuit heat dissipation (2006-08-01),

5. 6869827 - Semiconductor/printed circuit board assembly, and computer system (2005-03-22),

6. 6844217 - Die support structure (2005-01-18),

7. 6798055 - Die support structure (2004-09-28),

8. 6762079 - Methods for fabricating dual loc semiconductor die assembly employing floating lead finger structure (2004-07-13),

9. 6629425 - MEMS heat pumps for integrated circuit heat dissipation (2003-10-07),

10. 6541846 - Dual LOC semiconductor assembly employing floating lead finger structure (2003-04-01),

11. 6507107 - Semiconductor/printed circuit board assembly (2003-01-14),

12. 6469376 - Die support structure (2002-10-22),

13. 6274930 - Multi-chip module with stacked dice (2001-08-14),

14. 6207467 - Multi-chip module with stacked dice (2001-03-27),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]