The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2001
Filed:
Jun. 29, 2000
Venkateshwaran Vaiyapuri, Singapore, SG;
Jicheng Yang, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
A multi-chip module may be formed by wire bonding a first chip within a cavity in a multi-chip carrier. A second die may be positioned over the first die, elevated therefrom, using bump bonding. In some embodiments, only a single cavity is utilized and in other embodiments, multiple cavities may be utilized, one of which mounts a first chip and the other of which mounts a second chip. In some embodiments, the second chip may be a composite of two dice coupled back-to-back so that the lowermost die may be bump bonded to the carrier and the uppermost die, facing upwardly away from the carrier, may be wire bonded thereto.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile