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For the Inventor, By the Inventor

Singapore, Singapore

Jicheng Yang

This inventor holds 9 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2001-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jicheng Yang. Retrieved from https://idiyas.com/inventor/jicheng-yang-1x44ygbl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 9

% Patents Active = 100.0

Average Co-Inventor Count = 1.1

ph-index = 6

Forward Citations = 235(Granted Patents)


Location History:

  • Singapore, SG (2001 - 2005)
  • Newark, DE (US) (2004 - 2007)

Company Filing History:

goldMedal9 out of 39,253 
 
Micron Technology Incorporated
 patents

Years Active: 2001-2007

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9 patents (USPTO):Explore Patents
1. 7224070 - Plurality of semiconductor die in an assembly (2007-05-29),
2. 7078264 - Stacked semiconductor die (2006-07-18),
3. 6909167 - Coupling spaced bond pads to a contact (2005-06-21),
4. 6759307 - Method to prevent die attach adhesive contamination in stacked chips (2004-07-06),
5. 6620648 - Multi-chip module with extension (2003-09-16),
6. 6580160 - Coupling spaced bond pads to a contact (2003-06-17),
7. 6453547 - Coupling spaced bond pads to a contact (2002-09-24),
8. 6274930 - Multi-chip module with stacked dice (2001-08-14),
9. 6207467 - Multi-chip module with stacked dice (2001-03-27),

Title: Jicheng Yang: Innovator in Semiconductor Technology

Introduction

Jicheng Yang is a prominent inventor based in Singapore, known for his significant contributions to semiconductor technology. With a total of 9 patents to his name, Yang has made strides in developing methods that enhance the reliability and efficiency of semiconductor devices.

Latest Patents

Yang's latest patents focus on preventing adhesive contamination in semiconductor devices. One of his notable inventions is a method that includes an adhesive flow control dam positioned on the upper surface of a semiconductor device. This dam is strategically placed between electrical contacts and a substrate attach site, effectively blocking adhesive from contaminating the electrical contacts during the assembly process. This innovation ensures that the electrical contacts remain usable and free from excess adhesive, which can lead to device failure.

Career Highlights

Jicheng Yang is currently employed at Micron Technology Incorporated, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing solutions that address common challenges in the industry, particularly in the area of stacked semiconductor die packages.

Collaborations

Yang collaborates with fellow innovator Venkateshwaran Vaiyapuri, contributing to advancements in semiconductor technology through shared expertise and innovative ideas.

Conclusion

Jicheng Yang's contributions to semiconductor technology through his patents and work at Micron Technology Incorporated highlight his role as a key innovator in the field. His inventions not only improve the functionality of semiconductor devices but also pave the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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