Company Filing History:
Years Active: 2011-2020
Title: Uwe Schüβler: Innovator in Sputter Deposition Technology
Introduction
Uwe Schüβler is a notable inventor based in Aschaffenburg, Germany. He has made significant contributions to the field of sputter deposition technology, holding a total of 3 patents. His work focuses on advanced methods and systems for depositing materials in vacuum environments.
Latest Patents
Uwe Schüβler's latest patents include innovative technologies that enhance sputter deposition processes. One of his patents describes a sputter deposition source designed for use in a vacuum chamber. This source features a wall portion of the vacuum chamber, a target that provides the material to be deposited, and an RF power supply that connects to the target. The design includes a conductor rod that extends through the wall of the vacuum chamber, ensuring a defined RF return path.
Another patent outlines a system for depositing one or more layers on a substrate supported by a carrier. This system incorporates a load lock chamber for loading substrates, a transfer chamber for transportation, and a vacuum swing module that connects these components. The system is designed to operate under vacuum conditions or a controlled inert atmosphere, facilitating the deposition of organic materials.
Career Highlights
Throughout his career, Uwe Schüβler has worked with prominent companies in the technology sector. He has been associated with Applied Materials, Inc. and Applied Films GmbH & Co., where he has contributed to the development of cutting-edge technologies in the field of material deposition.
Collaborations
Uwe Schüβler has collaborated with several professionals in his field, including notable coworkers such as Stefan Bangert and Dieter Haas. Their combined expertise has further advanced the innovations in sputter deposition technology.
Conclusion
Uwe Schüβler's contributions to sputter deposition technology have established him as a key figure in the industry. His patents reflect a commitment to innovation and excellence in material deposition processes.