The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Feb. 04, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Stefan Bangert, Steinau, DE;

Uwe Schüβler, Aschaffenburg, DE;

Jose Manuel Dieguez-Campo, Hanau, DE;

Dieter Haas, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/40 (2006.01); H01L 51/56 (2006.01); C23C 14/04 (2006.01); C23C 14/12 (2006.01); C23C 14/24 (2006.01); C23C 14/50 (2006.01); C23C 14/56 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); C23C 14/042 (2013.01); C23C 14/12 (2013.01); C23C 14/243 (2013.01); C23C 14/505 (2013.01); C23C 14/566 (2013.01); C23C 14/568 (2013.01); H01L 51/001 (2013.01); H01L 51/0011 (2013.01);
Abstract

A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.


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