The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Nov. 05, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Stefan Keller, Mainaschaff, DE;

Uwe Schüβler, Aschaffenburg, DE;

Dieter Haas, San Jose, CA (US);

Stefan Bangert, Steinau, DE;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); C23C 14/35 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3408 (2013.01); C23C 14/35 (2013.01); H01J 37/32183 (2013.01); H01J 37/32577 (2013.01); H01J 37/3444 (2013.01); H01J 37/3455 (2013.01);
Abstract

A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.


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