Yongin, South Korea

Ung-Kwang Kim

This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2006-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ung-Kwang Kim. Retrieved from https://idiyas.com/inventor/ung-kwang-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.9

ph-index = 2

Forward Citations = 331(Granted Patents)


Company Filing History:


Years Active: 2006-2009

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2 patents (USPTO):Explore Patents

Title: Innovations of Ung-Kwang Kim in Semiconductor Technology

Introduction

Ung-Kwang Kim is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the development of wafer level chip scale packages. With a total of 2 patents, his work has advanced the efficiency and reliability of semiconductor manufacturing processes.

Latest Patents

One of his latest patents is a "Fabrication method of wafer level chip scale packages." This method involves forming a hole that penetrates through a chip pad of an integrated circuit (IC) chip. A base metal layer is formed on the first face of a wafer to cover the inner surfaces of the hole. An electrode metal layer fills the hole and rises over the chip pad. The second face of the wafer is then grinded to expose the electrode metal layer through the second face. By electroplating, a plated bump is formed on the exposed electrode metal layer. The base metal layer is selectively removed to isolate adjacent electrode metal layers, and the wafer is sawed along scribe lanes to separate individual packages from the wafer.

Another significant patent is the "Method for manufacturing wafer level chip stack package." This method includes preparing at least two wafers, each containing a plurality of corresponding semiconductor chips with through electrodes formed in the peripheral surface region. A solid adhesive region is applied to a central surface region, and the wafers are stacked and attached with the solid adhesive region. The corresponding through electrodes of adjacent semiconductor chips are connected, and the stacked wafers are divided into individual chip stack packages. This method aims to reduce the likelihood of void regions between adjacent semiconductor chips, thereby improving mechanical stability and reliability.

Career Highlights

Ung-Kwang Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technologies. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

He has collaborated with notable colleagues, including Soon-Bum Kim and Kang-Wook Lee, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Ung-Kwang Kim's contributions to semiconductor technology through his innovative patents have significantly impacted the industry. His work at Samsung Electronics Co., Ltd. exemplifies the importance of continuous innovation in enhancing electronic device performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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