This inventor holds 7 USPTO granted patents and 7 published patent applications. Top assignee: Applied Materials, Inc.. Active years: 2024-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024-2026
Title: An Insight into Inventor Ulrich Mueller
Introduction
Ulrich Mueller is an innovative inventor based in Berkeley, California. With one patent to his name, he has made significant contributions to the field of digital lithography tools. His work focuses on advanced packaging methods, which are crucial for enhancing substrate processing in various manufacturing environments.
Latest Patents
Ulrich Mueller holds a patent for an "Advanced-packaging high-volume-mode digital-lithography-tool." This patent embodies exemplary methods of packaging a substrate that may include rotationally aligning it to a predetermined angular position. The innovative process also encompasses transferring the substrate to a metrology station, measuring its topology, and applying a first chucking force to ensure flatness. The method further includes generating a mapping of a die pattern on the substrate’s exposed surface, followed by printing the designated pattern based on the previously mapped data.
Career Highlights
Mueller is associated with Applied Materials, Inc., where he continues to advance technology in substrate processing. His experience and expertise have positioned him as an influential figure in the field of high-volume digital lithography.
Collaborations
Throughout his career, Ulrich has collaborated with notable colleagues, including Shih-Hao Kuo and Hsiu-Jen Wang. These collaborative efforts have allowed them to converge their skills and knowledge towards innovative developments in digital lithography technology.
Conclusion
Ulrich Mueller's work significantly impacts the field of digital lithography through his advanced innovations. His patent reflects a commitment to enhancing manufacturing techniques, paving the way for improved substrate processing and packaging methods in the industry. His contributions, along with fruitful collaborations, continue to influence the evolution of technology in this domain.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
