This inventor holds 2 USPTO granted patents and 2 EPO patents. Top assignees: Carl Zeiss Multisem Gmbh, Genisys Gmbh. Active years: 2019-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019-2026
Title: Ulrich Hofmann: Innovator in Beam Lithography
Introduction
Ulrich Hofmann is a notable inventor based in Munich, Germany. He has made significant contributions to the field of beam lithography, a critical technology in the manufacturing of microelectronics. His innovative approach has led to advancements that enhance the precision and efficiency of lithographic processes.
Latest Patents
Ulrich Hofmann holds a patent for a process dose and process bias determination for beam lithography. This patent outlines a technique and method for determining a process dose for a beam lithography process. The method involves accessing a data set that associates measured dimensions of features exposed by beam lithography with different exposure doses. It also includes providing a model parameterized by various factors such as measured feature dimension, exposure dose, and process bias. The model is fitted with the data set to accurately determine the process dose and process bias.
Career Highlights
Hofmann is currently employed at Genisys GmbH, where he continues to develop innovative solutions in the field of lithography. His work has been instrumental in advancing the capabilities of beam lithography, making it more effective for various applications in microfabrication.
Collaborations
Throughout his career, Hofmann has collaborated with talented individuals such as Nezih Uenal and Nezih Ünal. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Ulrich Hofmann's contributions to beam lithography exemplify the impact of innovation in technology. His patent and ongoing work at Genisys GmbH highlight his commitment to advancing the field. His collaborations further enhance the potential for future breakthroughs in microfabrication.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile