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For the Inventor, By the Inventor

Wanluan, Taiwan

U-Ting Chen

This inventor holds 24 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Devices. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2015-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: U-Ting Chen. Retrieved from https://idiyas.com/inventor/u-ting-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 5.7

ph-index = 5

Forward Citations = 62(Granted Patents)


Company Filing History:

goldMedal24 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2025

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Areas of Expertise:
3DIC Interconnect
Semiconductor Devices
BSI Image Sensor
Stacked Image Sensor
Conductive Plugs
Interconnect Structure
Die Connection
Wafer Scribe Lines
Manufacturing Methods
Barrier Layer
24 patents (USPTO):Explore Patents
1. 12476224 - 3DIC interconnect apparatus and method (2025-11-18),
2. 12381195 - Semiconductor devices and methods of manufacture thereof (2025-08-05),
3. 11916091 - BSI image sensor and method of forming same (2024-02-27),
4. 11798916 - 3DIC interconnect apparatus and method (2023-10-24),
5. 11315972 - BSI image sensor and method of forming same (2022-04-26),
6. 10847560 - BSI image sensor and method of forming same (2020-11-24),
7. 10818720 - Stacked image sensor having a barrier layer (2020-10-27),
8. 10510729 - 3DIC interconnect apparatus and method (2019-12-17),
9. 10304818 - Method of manufacturing semiconductor devices having conductive plugs with varying widths (2019-05-28),
10. 10283547 - Stacked image sensor having a barrier layer (2019-05-07),
11. 10269843 - BSI image sensor and method of forming same (2019-04-23),
12. 10157891 - 3DIC interconnect apparatus and method (2018-12-18),
13. 10056353 - 3DIC interconnect apparatus and method (2018-08-21),
14. 9917121 - BSI image sensor and method of forming same (2018-03-13),
15. 9754925 - 3DIC interconnect apparatus and method (2017-09-05),

Title: The Innovative Journey of U-Ting Chen

Introduction:

U-Ting Chen, a talented inventor hailing from Wanluan, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

U-Ting Chen's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles and smart home systems, showcasing his commitment to revolutionizing everyday life through technology.

Career Highlights:

Throughout his illustrious career, U-Ting Chen has worked with renowned tech companies to develop state-of-the-art solutions in the areas of robotics, renewable energy, and healthcare. His innovative spirit and dedication to pushing the boundaries of technology have earned him recognition as a trailblazer in the industry.

Collaborations:

U-Ting Chen has collaborated with leading research institutions and universities worldwide to further his research and bring his visionary ideas to life. His partnerships have led to the development of groundbreaking technologies that have the potential to shape the future of various industries.

Conclusion:

In conclusion, U-Ting Chen's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His inventive mind continues to inspire and drive progress in the ever-evolving landscape of inventions and discoveries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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