Taoyuan, Taiwan

Tzu-Hsuan Wang

This inventor holds 6 USPTO granted patents. Top assignee: Unimicron Technology Corporation. Active years: 2020-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tzu-Hsuan Wang. Retrieved from https://idiyas.com/inventor/tzu-hsuan-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.9

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2025

Loading Chart...
6 patents (USPTO):Explore Patents

Title: Tzu-Hsuan Wang: Innovator in Electronic Devices

Introduction

Tzu-Hsuan Wang is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronic devices, holding a total of 6 patents. His innovative work focuses on enhancing the functionality and efficiency of electronic components.

Latest Patents

One of Tzu-Hsuan Wang's latest patents is an electronic device that includes a light-emitting element, an IC chip, a substrate, an optical waveguide layer, and an optical signal outlet. The IC chip is designed to control the light-emitting element to emit an optical signal. The light-emitting element is positioned on a first surface of the substrate, while the IC chip is located on a second surface. The optical waveguide layer, which consists of a core layer, a cladding layer, and a metal layer, is also placed on the first surface. The metal layer is situated at the interface between the core and cladding layers. The optical signal outlet is aligned with the light-emitting element, allowing the optical signal to reach it after traveling through the core layer.

Another notable patent is for a stacked die chip package structure and its manufacturing method. This chip package structure comprises a wiring board, a first chip, a second chip, a thermally conductive material, a molding compound, and a heat dissipation part. The wiring board features multiple circuit pads, with the first chip mounted and electrically connected to at least one of these pads. The first chip is positioned between the second chip and the wiring board. The thermally conductive material extends through both chips to the wiring board, while the molding compound is placed on the wiring board, and the heat dissipation part is thermally coupled to the conductive material.

Career Highlights

Tzu-Hsuan Wang is currently employed at Unimicron Technology Corporation, where he continues to innovate and develop advanced electronic solutions. His work has significantly impacted the industry, showcasing his expertise and commitment to technological advancement.

Collaborations

Some of Tzu-Hsuan Wang's coworkers include Chien-Chen Lin and Kuan-Wen Fong, who contribute to the collaborative environment that fosters innovation at Unimicron Technology Corporation.

Conclusion

Tzu-Hsuan Wang is a distinguished inventor whose work in electronic devices has led to

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…