The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Sep. 18, 2018
Unimicron Technology Corp., Taoyuan, TW;
Chien-Chen Lin, Taoyuan, TW;
Tzu-Hsuan Wang, Taoyuan, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A heat dissipation substrate includes an inner circuit structure, a first build-up circuit structure and a heat dissipation channel. The first build-up circuit structure is disposed on the inner circuit structure, and includes an interlayer dielectric layer, a first dielectric layer, a first patterned conductive layer and a plurality of first conductive vias. The first patterned conductive layer and the first dielectric layer are sequentially stacked on the interlayer dielectric layer. The heat dissipation channel is disposed around the chip disposing area on the first build-up circuit structure and has a first opening and a second opening. The first opening penetrates through the first dielectric layer and exposes a portion of the interlayer dielectric layer. The second opening is disposed on a side surface of the first build-up circuit structure. The first opening is in communication with the second opening.