Sherwood Park, Canada

Tyler Lee Brandon

This inventor holds 3 USPTO granted patents. Top assignee: Other. Active years: 2004-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tyler Lee Brandon. Retrieved from https://idiyas.com/inventor/tyler-lee-brandon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 86(Granted Patents)


Company Filing History:

goldMedal3 out of 834,513 
Other
 patents

Years Active: 2004-2006

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Innovations of Tyler Lee Brandon

Introduction

Tyler Lee Brandon is a notable inventor based in Sherwood Park, Alberta, Canada. He has made significant contributions to the field of integrated circuits and electronics, holding a total of 3 patents. His work focuses on enhancing the efficiency and scalability of electronic systems.

Latest Patents

One of his latest patents is titled "Method for scalable architectures in stackable three-dimensional integrated circuits and electronics." This innovative design allows for the creation of three-dimensional integrated circuit systems where all dies in a vertically bonded stack are identical. The method requires only one mask set and wafer type, as a single circuit design is produced for one die in the stack and reused for all dies with minimal modifications. This system scales directly with the level of stacking, incurring no extra design effort beyond the initial design.

Another significant patent is the "Bi-directional amplifier and method for accelerated bus line communication." This invention discloses a circuit and method that accelerates bus line communication in integrated circuits. It achieves high-speed signal transmission along a bus line by driving a series of bus line segments with their own bi-directional bus amplification circuits. Each segment has less capacitive loading than longer non-segmented bus lines, allowing for rapid voltage reversal or data inversion. The bi-directional bus amplification circuit connects two lines while actively amplifying the signal in either direction without prior knowledge of the signal's direction.

Career Highlights

Throughout his career, Tyler has demonstrated a commitment to advancing technology in the field of electronics. His innovative approaches have led to patents that address critical challenges in integrated circuit design and communication.

Collaborations

Tyler has collaborated with notable colleagues, including Raymond Jit-Hung Sung and John Conrad Koob. Their combined expertise has contributed to the development of groundbreaking technologies in their field.

Conclusion

Tyler Lee Brandon's contributions to the field of integrated circuits and electronics are noteworthy. His innovative patents reflect his dedication to improving technology and enhancing communication systems. His work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…