Company Filing History:
Years Active: 2003-2008
Title: Innovations of Tung-Lung Lai
Introduction
Tung-Lung Lai is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and reliability of semiconductor devices.
Latest Patents
Lai's latest patents include innovative solutions for barrier layer stacks designed to prevent titanium (Ti) diffusion. One of his patents describes a barrier layer stack that includes a semiconductor process wafer with an exposed conductive region. This stack comprises a first barrier layer that includes at least one titanium nitride (TiN) and one titanium (Ti) layer, which are in contact with the conductive region. An overlying aluminum alloy layer is also in contact with this first barrier layer stack. Another patent presents an improved barrier layer stack and method for preserving the resistivity of aluminum alloy interconnects. This method involves forming an alternating sequence of TiN and Ti layers, culminating in an uppermost barrier layer of TiN, which is then subjected to high temperatures exceeding 350°C.
Career Highlights
Tung-Lung Lai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing semiconductor fabrication techniques, contributing to the overall efficiency of electronic devices.
Collaborations
Lai has collaborated with several esteemed colleagues, including Kong-Beng Thei and Chun-Lung Cheng. These partnerships have fostered innovation and have been crucial in the development of his patented technologies.
Conclusion
Tung-Lung Lai's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in electronic device manufacturing.