Company Filing History:
Years Active: 2014-2017
Title: Innovations of Tung Bao Lu
Introduction
Tung Bao Lu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods for manufacturing semiconductor packages and structures.
Latest Patents
One of his latest patents is titled "Semiconductor package and method of manufacturing thereof." This invention describes a semiconductor package that includes a semiconductor chip with an active surface featuring a conductive pad. It also incorporates an electroplated Au–Sn alloy bump and a substrate with conductive traces that electrically couple with the bump. The method of manufacturing this package involves forming patterns of conductive pads, electroplating the alloy bump, and bonding the chip to the substrate through reflow or thermal press operations.
Another significant patent is "Semiconductor structure having a silver alloy bump body and manufacturing method thereof." This patent outlines a method for creating a semiconductor structure that includes forming a conductive pad on a semiconductor die and a seed layer over it. The process involves defining a mask layer and forming a silver alloy bump body, utilizing a cyanide-based bath and controlling the pH for optimal results.
Career Highlights
Tung Bao Lu is currently employed at Chipmos Technologies Inc., where he continues to innovate in semiconductor technology. His work has contributed to advancements in the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
He collaborates with talented coworkers, including Shih Jye Cheng and Heng-Sheng Wang, who share his commitment to advancing semiconductor technology.
Conclusion
Tung Bao Lu's contributions to semiconductor technology through his patents and work at Chipmos Technologies Inc. highlight his role as an influential inventor in the field. His innovative methods are paving the way for future advancements in semiconductor manufacturing.