The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2014
Filed:
Nov. 06, 2013
Chipmos Technologies Inc., Hsinchu, TW;
Shih Jye Cheng, Hsinchu, TW;
Tung Bao Lu, Hsinchu, TW;
Chipmos Technologies Inc., Hsinchu, TW;
Abstract
A semiconductor structure includes a device, a conductive pad on the device, and a AgYalloy bump over the conductive pad. The Y of the AgYbump comprises metals forming complete solid solution with Ag at arbitrary weight percentage, and the X of the AgYalloy bump is in a range of from about 0.005 to about 0.25. A difference between one standard deviation and a mean value of a grain size distribution of the AgYalloy bump is in a range of from about 0.2 μm to about 0.4 μm. An average grain size of the AgYalloy bump on a longitudinal cross sectional plane is in a range of from about 0.5 μm to about 1.5 μm.