Tsz Fung Au

Title: Innovations by Tsz Fung Au in Low-Temperature Soldering

Introduction

Tsz Fung Au is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of low-temperature soldering, particularly through his innovative patent related to tin-bismuth alloys. His work is crucial for advancements in 3D integrated circuits (3D-ICs), where low-temperature bonding is essential.

Latest Patents

Tsz Fung Au holds a patent for "Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding." This invention involves the use of specific reagents added to an electrolyte bath to co-deposit tin-bismuth alloys. Reagent A is a larger acid molecule that binds to Bi ions, while reagent B is a smaller molecule that fills the spaces between the larger molecules. This innovative approach reduces the standard electrode potential difference of Sn and Bi, allowing for co-deposition rates that yield a Sn—Bi alloy with 30-70% Bi by weight, around the 58% eutectic, and a melting point below 180° C. This makes it suitable for low-temperature solder applications. Additionally, Reagent C enhances the alloy's microstructure by removing hydrogen gas generated at the cathode, which can obstruct the uniform deposition of Bi ions.

Career Highlights

Tsz Fung Au is affiliated with the Hong Kong Applied Science and Technology Research Institute. His work at this institution has allowed him to focus on research and development in advanced materials and soldering techniques. His innovative contributions have positioned him as a key figure in the field of electronics manufacturing.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Tsz Fung Au's innovative work in low-temperature soldering through his patent on tin-bismuth alloys represents a significant advancement in the field of electronics. His contributions are vital for the future of 3D-IC technology and low-temperature bonding applications.