The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Dec. 20, 2023
Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, HK;
Minjie Xu, Hong Kong, HK;
Xunqing Shi, Hong Kong, HK;
Pau Yee Lim, Hong Kong, HK;
Tsz Fung Au, Hong Kong, HK;
Abstract
Reagents A, B, C are added to an electrolyte bath for co-depositing tin-bismuth alloys (Sn—Bi). Reagent A is a larger acid molecule that binds to Biions while reagent B is a small molecule that binds to the Biions in spaces between the reagent A molecules. Reagents A and B reduce the standard electrode potential difference of Sn and Bi to permit co-deposition rates that yield a Sn—Bi alloy of 30-70% Bi by weight, around the 58% eutectic, with an alloy melting point below 180° C. for use as a low-temperature solder. Reagent C has a hydrophilic end that attaches to the electrode surface and a hydrophobic tail that is an aliphatic chain that attracts hydrogen gas, removing Hgas from the electrode surface. Reagent C improves alloy microstructure by removing Hgas generated at the cathode that can block Biions from uniformly depositing on the surface.