This inventor holds 5 USPTO granted patents and 4 published patent applications. Top assignee: Hong Kong Applied Science and Technology Research Institute. Active years: 2016-2026.
Company Filing History:
Years Active: 2016-2026
Title: Innovations by Pau Yee Lim
Introduction
Pau Yee Lim is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of technology, particularly in the development of advanced materials and thermal management systems. With a total of 5 patents to his name, Lim's work is recognized for its innovative approaches to solving complex engineering challenges.
Latest Patents
One of Pau Yee Lim's latest patents is focused on co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding. This invention involves the use of specific reagents to create a tin-bismuth alloy that can be used as a low-temperature solder, with a melting point below 180° C. The process enhances the microstructure of the alloy by effectively removing hydrogen gas that can hinder the deposition of Bi ions.
Another significant patent addresses thermal regulatory modules useful for cooling energy packs. This invention describes a thermal conductive composite with a non-uniform heat absorption profile. The design allows for efficient heat transfer away from heat sources, utilizing a gradient structure that optimizes the thermal management of energy systems.
Career Highlights
Pau Yee Lim is affiliated with the Hong Kong Applied Science and Technology Research Institute, where he continues to push the boundaries of research and innovation. His work has been instrumental in advancing technologies that improve energy efficiency and thermal management.
Collaborations
Lim has collaborated with notable colleagues, including Laiyong Xie and Jing Xiang, to further enhance the impact of his research and inventions.
Conclusion
Pau Yee Lim's contributions to technology through his patents and research exemplify the spirit of innovation. His work not only addresses current challenges but also paves the way for future advancements in materials science and thermal management.